Description
The Epo-Tek H20E Adhesive is a specialized two-component, 100% solids silver-filled epoxy system. It is meticulously designed for critical chip bonding applications within microelectronic and optoelectronic industries, as well as for SEM sample preparation. This adhesive offers reliable performance and is supplied in a convenient 1 oz container, often featuring a syringe with a built-in plunger for precise application.
- Two-component, 100% solids silver-filled epoxy system.
- Designed for chip bonding in microelectronic and optoelectronic applications.
- Suitable for SEM sample preparation.
- Comes in a 1 oz container, often with a syringe and plunger.
Discover the precision and reliability of the Epo-Tek H20E Adhesive for your advanced bonding needs.
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